Product Summary
hese MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny SeriesCPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implementssophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable ofexecuting instructions at high speed
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![]() R5F21244SNFP#U0  | 
                            ![]() Renesas Technology America  | 
                            ![]() IC R8C MCU FLASH 16K 52LQFP  | 
                            ![]() Data Sheet  | 
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![]()  | 
                            ![]() R5F21244SNFP#V0  | 
                            ![]()  | 
                            ![]() IC R8C MCU FLASH 16K 52LQFP  | 
                            ![]() Data Sheet  | 
                            ![]() 
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 (Hong Kong) 
                         
                        
                                    






