Product Summary
hese MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny SeriesCPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implementssophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable ofexecuting instructions at high speed
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![]() R5F21244SNFP#U0 |
![]() Renesas Technology America |
![]() IC R8C MCU FLASH 16K 52LQFP |
![]() Data Sheet |
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![]() R5F21244SNFP#V0 |
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![]() IC R8C MCU FLASH 16K 52LQFP |
![]() Data Sheet |
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